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Lenovo ThinkServer RD550 server 2.3 GHz Intel Xeon E5 v3 E5-2670V3 Rack (1U) 750 W

Quick Overview

2x Intel Xeon E5-2670 v3 (12C/2.3GHz/30MB), 1x8GB 2133MHz RDIMM (up to 384GB DDR4), 4x3.5" HS, RAID 720i + 1GB RAM, DVD±RW, 1x RJ45 GbE, 2x USB 3.0, 2x USB 2.0, 2x DisplayPorts, 1x serial, 750W (Platinum), No OS
Extremely Versatile Storage
Innovation is built in to the ThinkServer RD550. A cleverly engineered design allows more storage density and I/O connectivity than ever before—giving you the performance and capacity of a 2U system in a 1U form factor. By creating smaller drive trays and a slightly larger chassis within the same 1U space, the RD550 offers a total of up to 12 bays, which can be used for data storage or better performance. Two additional enterprise-class M.2 solid-state drives (SSDs) are available as an option for secure booting, as well as SD card options for hypervisor booting. Plus, for ultimate performance, the industry-unique Lenovo AnyBay design allows multiple storage types in the same drive bay, including front-accessible PCIe SSD.

Highly Flexible I/O
In the past, 1U servers were constrained by their size and did not have as many I/O slots as larger servers. With the new RD550, networking configurations that traditionally required a larger server can now fit into a 1U form factor. Leveraging the unique Lenovo AnyFabric design, the RD550 can house up to eight 10Gb Ethernet ports—without taking up any of the available PCIe slots. If you include network adapters in the available slots, the RD550 can support an incredible amount of network bandwidth in a single 1U server. There’s even an option for four 10Gb Ethernet ports with two 16Gb Fibre Channel ports at the same time, without using any of the PCIe slots—an industry first.

Extra-Reliable Performance
Data center cooling costs can be greater than the cost of powering the IT equipment itself. One way to reduce these cooling costs is by operating the data center at a higher temperature. With a dynamic environmental design, the RD550 can run continuously at 45 degrees Celsius—with no impact on reliability. In fact, the system has been carefully architected and tested to support long-term reliability. The RD550 is also perfect for organizations that install servers in less strictly controlled environments. Other high-reliability features include error correcting code (ECC) memory, hot-swap hard-disk drive and SSD capability, and hot-swap and redundant power and cooling.
SKU 70CV001GUX
EAN 8889650902016
Manufacturer Lenovo
Reviews No
PDF Url http://pdfs.icecat.biz/pdf/44811649-2847.pdf
Contract ID N/A
Processor
Thermal Monitoring TechnologiesYes
Thermal Design Power (TDP)120 W
Tcase84.5 °C
Supported instruction setsAVX 2.0
SteppingM1
Scalability2S
Processor threads24
Processor package size52.5 mm
Processor operating modes64-bit
Processor lithography22 nm
Processor codenameHaswell
Physical Address Extension (PAE)46 bit
PCI Express configurationsx4, x8, x16
Number of QPI links2
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor1600,1866,2133 MHz
Memory channels supported by processorQuad
Memory bandwidth supported by processor (max)68 GB/s
Maximum number of PCI Express lanes40
Maximum internal memory supported by processor768 GB
Idle StatesYes
FSB ParityNo
Execute Disable BitYes
Embedded options availableNo
ECC supported by processorYes
Bus typeQPI
Processor cache typeSmart Cache
Processor cache30 MB
Conflict Free processorNo
Processor seriesIntel Xeon E5-2600 v3
Processor frequency2.3 GHz
Number of processors installed2
Processor modelE5-2670V3
Processor boost frequency3.1 GHz
System bus rate9.6 GT/s
Processor socketLGA 2011-v3
Processor cores12
Motherboard chipsetIntel® C612
Maximum number of SMP processors2
Processor familyIntel Xeon E5 v3
Memory
Internal memory8 GB
Memory layout (slots x size)1 x 8 GB
Flash memory1024 MB
Memory slots8 RDIMM
Memory clock speed2133 MHz
Maximum internal memory384 GB
Internal memory typeDDR4-SDRAM
ECCYes
Storage
Hot-swapYes
RAID supportYes
RAID levels0,1,5,6,10
Number of HDDs supported4
HDD size3.5"
HDD interfaceSerial ATA III,Serial Attached SCSI (SAS)
Graphics
Maximum graphics adapter memory16 MB
On-board graphics adapterYes
Graphics adapter familyAspeed
Graphics adapterAST2400
Networking
Ethernet LANYes
Ethernet interface typeGigabit Ethernet
Cabling technology10/100/1000Base-T(X)
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity2
USB 2.0 ports quantity2
Serial ports quantity1
Ethernet LAN (RJ-45) ports1
DisplayPorts quantity2
Expansion slots
PCI Express x16 (Gen 3.x) slots2
PCI Express slots version3.0
Optical drive
Optical drive typeDVD±RW
Design
Redundant fans supportYes
Optical drive typeDVD±RW
Chassis typeRack (1U)
Performance
Compatible operating systems- Microsoft Windows Server 2012 R2, 2012, 2008 R2, Windows Small Business Server 2011
- Red Hat Enterprise Linux 6.5, SUSE Linux Enterprise Server 11
- VMware vSphere (ESXi) 5.5 U2
Noise level6.5 dB
Trusted Platform Module (TPM) version1.2
Trusted Platform Module (TPM)Yes
Security featuresPower-on and administrator password
Operating system installedNo
Software
Compatible operating systems- Microsoft Windows Server 2012 R2, 2012, 2008 R2, Windows Small Business Server 2011
- Red Hat Enterprise Linux 6.5, SUSE Linux Enterprise Server 11
- VMware vSphere (ESXi) 5.5 U2
Operating system installedNo
Processor special features
Intel® Wireless Display (Intel® WiDi)No
Intel® Identity Protection Technology (Intel® IPT)No
Enhanced Intel SpeedStep TechnologyYes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® OS GuardYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel® vPro™ TechnologyYes
Intel® Turbo Boost Technology2.0
Intel TSX-NINo
Intel Trusted Execution TechnologyYes
Intel® Smart CacheYes
Intel® Secure KeyYes
Intel® Quick Sync Video TechnologyNo
Intel® My WiFi Technology (Intel® MWT)No
Intel® InTru™ 3D TechnologyNo
Intel® Insider™No
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel Flex Memory AccessNo
Intel Enhanced Halt StateYes
Intel Demand Based SwitchingYes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)No
Intel Clear Video TechnologyNo
Intel® Clear Video HD Technology (Intel® CVT HD)No
Intel® Anti-Theft Technology (Intel® AT)No
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel 64Yes
Intel Virtualization Technology (VT-x)Yes
Intel TSX-NI version0.00
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version0.00
Intel FDI TechnologyNo
Intel Dual Display Capable TechnologyNo
Intel Fast Memory AccessNo
Processor ARK ID81709
Intel Rapid Storage TechnologyNo
CPU configuration (max)2
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Power
Number of main power supplies1
Redundant power supply (RPS) supportYes
Power supply750 W
Operational conditions
Storage temperature (T-T)-10 - 60 °C
Operating relative humidity (H-H)8 - 90%
Storage relative humidity (H-H)8 - 90%
Operating temperature (T-T)5 - 45 °C
Operating altitude0 - 120000" (0 - 3048 m)
Technical details
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Intel Rapid Storage TechnologyNo
Noise level6.5 dB
Trusted Platform Module (TPM) version1.2
Trusted Platform Module (TPM)Yes
Security featuresPower-on and administrator password
Redundant fans supportYes
Ethernet interface typeGigabit Ethernet
CPU configuration (max)2
Chassis typeRack (1U)
Weight & dimensions
Width19" (482 mm)
Weight29.8 lbs (13.5 kg)
Height1.69" (43 mm)
Depth30.7" (780 mm)
Other features
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Graphics adapter familyAspeed
Graphics adapterAST2400
CPU configuration (max)2